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Epoxy Resin Applied in Bonding Agent

Bonding agent is a substance that binds different materials together by adhesion interface or cohesive action. iAbrasive has made some research into epoxy resin to analyze their influence on bonding agent.

From: iAbrasive.comDate: 2014-08-09 07:17:13Views: 394

epoxy resin

Bonding agent is a substance that binds different materials together by adhesion interface or cohesive action. Bonding agent can be natural or synthetic, organic or inorganic. The main component can be resin, rubber or high-molecular compound. iAbrasive has made some research into epoxy resin to analyze their influence on bonding agent.

The main component of epoxy resin bonding agent is epoxy resin. There are a number of epoxy rings in a epoxy resin unit. The epoxy rings network structure function with curing agent and change bonding agent properties. Epoxy group of unsaturated group, because of the oxygen atom electronegativity and considering the role of oxygen their lone pair electrons, the electron cloud density is higher that can accept the electrophilic group attack. A single low toughness epoxy resin in the curing conditions, impact resistant ability is weak, difficult in application. The following is an analysis on epoxy resin on the properties of adhesive:

1. As the main body of bonding agent, epoxy resin glue has a relatively strong impact on bonding agent intensity. Following is some figures showing tensile degree by Elmendorf test:

Table 1

When its component remains unchanged, simply take epoxy resin as the research object, based on statistics, with epoxy resin quantity changes, its tensile degree decreases. In conclusion, epoxy resin quantity change may have an influence on epoxy resin bonding agent.

2. With epoxy resin quantity changing, epoxy unsaturated group will change and affect its function with curing agent. Following is a simple analysis:

Table 2

Analyze from the figures, because epoxy resin added quantity increases, its function with bonding agent is longer, response degree is low, and viscosity is on the low side.

3. During an experiment process, one can do some research into epoxy resin influence on bonding agent properties. With temperature rises, epoxy resin bonding agent toughness and viscosity gradually decrease, epoxy resin molecular hydrogen bonds fracture and viscosity declines; when temperature reaches 75 degrees centigrade, viscosity becomes invalid.

 

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