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Nano Diamond Applied in Thermal Packing Materials

A functional nano diamond material manufacturers in Finland has done some research and experiments into nano diamond materials that can be applied in thermal packing materials.

From: iAbrasive.comDate: 2014-08-02 03:20:28Views: 567

nano diamond

A functional nano diamond material manufacturers in Finland has done some research and experiments into nano diamond materials that can be applied in thermal packing materials. To reach 45% thermal packing materials carrying capacity, the company increased 0.03wt.% nano diamond to have polymer heat conductivity improved by 20%. Compared with usual heat conduction material, nano diamond material can increase heat conductivity at lower cost.

The Finnish company has recently published thermal packing materials statistics. By adopting 0.1.wt% precision nano diamond material to replace the best heat conductivity material--boron nitride (45 wt.%), thermal compounding polyamide 66 can increase 25% heat conductivity; the latest precision nano diamond material and compound processing can be improved similarly; however, nano diamond consuming has been reduced by over 70%, so the cost will be less.

The sample of experiment is made in Finnish VTT technical center, while thermal performance is tested in German ESK (3M). According to the chief technical officer of the Finnish company, the material's heat conductivity property owes to nano diamond material, whose performance has been optimized so as to be applied in polyamide and other thermal packaging materials.

For 4 to 6 nano diameter explosive synthetic diamond, although its potential properties can be employed, problems may occur to surface active chemical property. The Finnish company takes advantage of its surface chemical property to scatter the particles that mix together in parent materials, especially polyamide. Therefore, diamond has the best properties that may hardly affect other materials. So it is more cost-effective and has higher concentration.

To meet the requirements, heat conductivity is supposed to be increased to 100% and 20% of thermal packing materials is nano diamond. "Heat conductivity increase has little impact on material isolation performance, other machinery properties or decline tool abrasion degree; it makes nano diamond widely used in electronic and LED fields." Chief technical officer from the Finnish company says.

 

 

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