Research Status of Diamond Circular Saw Blade in China

According to market research analysis, at present, common matrix diamond saw blade is still the most widely used in various engineering fields that need to use diamond circular saw blades. We can also find that common matrix diamond circular saw blade can meet the requirements of most cutting, but there are still many problems in circular saw blades, which affect the cost of saw blades and the improvement of cutting quality.

Aiming at many problems of circular saw blades, researchers study the matrix composition of segments, cobalt content, diamond, different tungsten carbide powder and the influence of sintering process on the sharpness and the service life of saw blades, and have developed sharp concrete special circular saw blade.

Through the analysis for distribution state of diamond on the working surface of diamond circular saw blade and the characteristics of the movement of saw blade, researchers have got the distance between diamonds on the working surface and the motion trajectory of diamond, and on the basis of that, they deduce the calculation formula of cutting thickness of single diamond, and discuss the relationship between the cutting thickness, the cutting parameters and the block structure.

Researchers comprehensively introduce research results about diamond circular saw blade matrix optimization at home and abroad and sawtooth structures of diamond saw blade, and analyze all kinds of characteristics, existing problems, and production value about preventing flank wear and stress deformation, improving the cooling performance of saw blade matrix and sawtooth structure.

In the increasingly competitive today, diamond saw blades with specialization and product diversification will undoubtedly have stronger vitality and attraction, and broader market appeal. Related enterprises must manage their own characteristics, and at the same time, keep up with the development and demand of the market. Only in this way, can they get a place in the market.