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Processing Methods of Electroplated Diamond Grinding Wheels

It is necessary to learn about several methods of regulating the concentration of diamond on the working surface of electroplated diamond grinding wheels.

From: iAbrasive.comDate: 2015-06-10 08:40:50Views: 748

What is the processing methods of electroplated diamond grinding wheels? Diamond grinding wheels made of electricity chemistry, include diamond dressing grinding wheel, grinding or diamond grinding wheels for cutting.

Manufacture process of diamond grinding wheels is as follows:

The working layer of diamond grinding wheels contains the diamond grits and diamond abrasive is bonded on the substrate by metal bond. First of all, the thickness of the deposited metal bond is 20% of the height of diamond grits, and then using the metal bond to bond diamond grits (thickening), the thickness is about two-thirds of the height of abrasive grains. The downside of this approach is that the concentration of diamond is too dense on the work surface of abrasives.

Several methods of regulating the concentration of diamond on the working surface of electroplated diamond grinding wheels are as follows:

Diamond abrasive and packing need to be mixed in advance, and the packing can be the salt, the ball or magnetic particles. After bonding, 20% of the filler particles are bonded by metal binder. These packing can be removed by the following methods respectively: dissolution methods, sublimation methods or magnetic fields methods. In these methods the particle size of packing is roughly the same with the size of diamond abrasive grains, and the dosage of filler should make the concentration of diamond working on the surface of abrasive reaching regulations. The shortcomings of these methods are that the removal of the packing is more complex, which needs a set of methods.

Another kind of packing is to use spherical particle filler whose surface is smooth in addition to the simpler method. First of all, the thickness of the deposited metal bond is of 20% of the height of diamond grits; Secondly, use a brush to brush off the packing; Finally, use metal bond deposit to the required thickness. This method uses this effect that metal bond with different rough surface and shape of particles has different bonding abilities, whose disadvantage is that the particle size of packing is roughly the same with the size of diamond abrasive grains, so they are in the same plane after bonding, but when using the mechanical method, it may brush off the part of the diamond abrasive together, especially those particles that is close to the shape of equal area and have smooth surface. 

As the improvement of above methods, the size of packing should be 1.5-5.0 times of the particle size of diamond abrasives. When metal bond is for electrode position for the first time, diamond abrasive is bonded by metal bond layer about 20% of its height, and the packing particles is bonded by the metal bonding layer about its height of 4-13%. The kind of thickness of metal bond layer cannot control any rough filler particles in shape. Therefore, it can be gently remove the packing from the grinding wheel surface with the brush tool, oil stone and cutting tools.

 

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