Meller Sapphire Wafer Carriers Assure Consistent Part-to-Part Uniformity

Meller Optics, Inc. has introduced a series of custom fabricated sapphire wafer carriers that feature uniform thickness and parallelism and are highly durable for thinning semiconductors.

Meller Sapphire Wafer Carriers feature Moh 9 hardness, which is second only to diamond, allowing them to be produced as thin as 0.018" with 1.2 micron uniform thickness and 10 arc-sec. parallelism. Custom perforated with hole patterns to fit vacuum hold-down or de-lamination fixtures, they facilitate semiconductor thinning to assure consistent part-to-part uniformity.

Ideally suited for thinning GaAs and other semiconductor materials, Meller Sapphire Wafer Carriers are available in 2" to 6" dia. sizes and can be supplied with reference flats and laser markings. Capable of withstanding repeated use, these sapphire wafer carriers are hard, strong, chip- and scratch-resistant, and are impervious to solvents and etchants.

Meller Sapphire Wafer Carriers are priced according to size, configuration, and quantity; with 4 to 6 week delivery. Pricing is available upon request.

About Meller Optics, Inc.

Founded in 1921, Meller Optics has been providing high quality optics to defense, medical, laser, and industrial markets for 90 years now. Specializing in the grinding and polishing of hard, durable materials such as sapphire and ruby, the company has also developed high-speed, low-cost finishing processes for a variety of optical materials such as laser glasses, fused silica, zinc selenide, germanium, silicon, fluorides, and ceramic materials. Configurations include windows, substrates, lenses, domes, and prisms.