Lapping Plate Conditioning Device eliminates variability issues

Engis Corporation's unique FastLap Facing Device, an option for its FastLap series of lapping and polishing machines, increases plate flatness to improve precision and repeatability when manufacturing semi-conductors, optical devices, LEDs, MEMs (micro-electro-mechanical systems), precision medical components, electronics, carbides, steels and ceramics.

The FastLap Facing Device uses a diamond tool bit to remove the top (worn) layer of the lapping plate, machining it flat to within microns (view video). To produce a controlled surface geometry and texture, the device then makes a second pass, which machines a groove pattern that serves as the basis for structured embedding of abrasive particles. Plates reconditioned with a facing device show excellent batch-to-batch surface consistency.

The costs of raw materials in lapping operations, such as sapphire for optical components or gallium nitride for semi-conductors, tend to be expensive. Further, lapping occurs at the end of the manufacturing process. A rejected part loses not just the value of the material, but all of the value-added manufacturing steps as well. As such, the predictable, repeatable and controlled results from the FastLap Facing Device can reduce total cost of operation while providing an additional quality assurance.

From: http://news.thomasnet.com/fullstory/Lapping-Plate-Conditioning-Device-eliminates-variability-issues-588596