Post Buying Request

Influence of Particle Size on Silicon Carbide

Whoever has the best cutting tool, he will become the cutting head, so silicon carbide powder occupies a pivotal position in the section-cutting industry.

From: iAbrasive.comDate: 2015-05-20 07:05:21Views: 490

 

Photovoltaic material is also called the solar cell material, and only semiconductor material has this function. Solar photovoltaic industry chain is divided into five links, namely, from the silicon to silicon wafers, solar cells, solar cell components, and the photovoltaic system applications. The upstream silicon wire-cutting technology of photovoltaic industry mainly adopts silicon carbide powder as the main cutting material along with other reagents for cutting, in which the situation of quality of green silicon carbide micro powder directly determines the efficiency of the slice. Therefore, silicon carbide extract fine powder is indispensable consumptive material in the process of cutting, which is also known as the tool in the hands of photovoltaic enterprises. Whoever has the best cutting tool, he will become the cutting head, so silicon carbide powder occupies a pivotal position in the section-cutting industry.

With the rapid development of photovoltaic industry, the demand is increasing for silicon wafer line cutting with silicon carbide, whose powder is indispensable and special material in the production of solar silicon wafer that has a huge market at home and abroad, and the economic benefit is quite good. At present it is mostly given priority to green silicon carbide micro powder at home, because its own characteristics is more suitable to be used in the cutting blade material of photovoltaic and semiconductor silicon wafers.

The influence of particle size on silicon carbide

Silicon carbide powder is one of the most abrasives mainly used for multiple linear cutting machine, and its granule shape and particle size are the key to cutting ability and bright and clean degree of silicon wafer. Then there is also granule shape and particle size of silicon carbide powder, the viscosity of slurry, the flow of slurry, the speed of the steel wire, the tension of steel wire and the speed of workpiece, etc. In fact the cutting of silicon wafer is the cutting of silicon carbide powder particles. If the grain shape is good, the surface finish you will get is also very great, and if the particle size distribution is narrow and uniform, the cutting ability of silicon wafer will be greatly improved.

 

share:

Top News

Sponsored links