• φ4-inch Sapphire Slicing Time ~ 6 hours.

  φ6-inch sapphire Slicing Time ~12 hours.

   

  MDWEC agent the new multi-wire saws for diamond wire dedicated machine that has been design by Toyo Advanced Technologies Co., Ltd.

  Model. no .T-8331A productivity is significantly enhanced by shorten the cutting time of hard-to-process materials to a half. This machine is applied to cut up toφ6-inch and 300mm length ingots.

  T-8331A is introduced to meet the increasing demand to shorten their cutting time.

Property

T-8331A has been developed supposing to use diamond wire. Employing technologies to utilize the most of diamond wire capability, it realized

(1) Double productivity (cutting in 6 hours, a half of conventional machine)

(2) High-precision processing of TTV 10μm and Bow 10μm

(3) Low running cost of wire consumption 15m/wafer at the case of φ4-inch sapphire ingot

The rocking column mechanism, which rocks column holding wire guides to cut hard-to-process materials effectively.

Overall machine rigidity is enhanced with high-rigid structure integrated rocking mechanism to column, etc.

Twist-free wire management system which prevents wire twisting and skewing and tension control which maintains wire tension uniformly, etc. are devised to make the most of diamond wire performance.