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Well Expeding Ent. Co., Ltd
[ Taiwan ]

    Main Products:
  • Diamond Wire
  • Edge Grinding Wheel
  • Polishing
    Business Type:
  • Manufacturer
  • Trading Company

View Contact Details

iAbrasive AD

Single Side Cu Polishing M/C

Product Details

Taiwan

Payment & Shipping Terms

Detailed Product Description

  • WEC Single Side Lapping/Polishing machines SSP-50DPAW feature rotary models with sophisticated control systems. This model is capable of executing complex lapping and polishing routines process while producing precise and repeatable results with a special auto-facing unit to control plate performance.l

     

Application

Sapphire Substrate / Wafer

Semiconductor Wafer

Tungsten Carbide Parts

Ceramic Parts

Valves

Crystal Glass

Oscillator Parts

Standard

Description

Items

SSP-36DPAW

SSP-50DPAW

Polishing plate

Plate material

Oxygen free Cu , Resin-Cu

Oxygen free Cu

Or Tin plate (*option)

or Tin plate(*option)

Plate size

Φ910mm

Φ1240mm

Revolution control

By inverter.

Home position.

Plate cooling

Cooling water jacket

Cooling water jacket

Pressure plate

P. Plate

4 axles.

4 axles.
(driving force system individually)

Block size

360mmΦ

485mmΦ

Applied pressure

By cylinder

By cylinder

Work block

-

Auto Centering

Facing unit

Mounting type.

Square type.

Capacity / batch

4 inch wafer x 24 Pcs

4 inch wafer x 40 Pcs

6 inch wafer x  12 Pcs

6 inch wafer x 24 Pcs

Utility

Electricity

AC220V, 3Phase, 60Hz

AC220V, 3Phase, 60Hz

Pneumatic

0.5~0.8 Mpa

0.5~0.8 Mpa

Etc

Machine Size

1350 *2250 *1920 mm

1640 *3029 *2575 mm

Machine Weight

3,500Kg.

5,500Kg.

Controller

Touch Screen (Proface)

Touch Screen (Proface)

Signal  lamp with alarm

 

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