MBD-CDW series adopt the high quality raw materials with the high strength and high purity, regular crystal shape, narrow particle size distribution, good thermal stability and high wear resistance.

MBD-CDW series utilize the high quality diamond source with good internal integrity and regular shape, our technical staff customize the improved processes and solutions to offer optimum and consistent performance, improved crushing and mirconizing techniques enable to help our customers to achieve and maintain the higher effective cutting surfaces, the refined cleanly graded procedure offer the more rougher retention.

MBD-CDW series can offer maximize cutting efficiency while producing the minimal amount of kerf loss throughout the life of the cutting behaviour, especially cutting ultra thin wafers for quicker production and lower costs.

Our Diamond powder for Wire Saw have been used in many wire saw devices and can provide better efficiency compared to other competitors.

Available particle sizes

The particle shape and size can be customized according to your request.

Proprietary manufacturing process

Key quality control

1.Particle shape control to ensure the narrow particle size distribution

2.Strict surface purity control can achieve the excellent diamond retention for the diamond wire

Product advantage

MBD-CDW series adopt the high quality raw materials with the high strength and high purity, regular crystal shape, narrow particle size distribution, good thermal stability and high wear resistance.

Application

MBD-CDW series diamond powder show the excellent performance in monocrystalline silicon, polycrystalline silicon, sapphire, LED substrate and semiconductor cutting, squaring, slicing, cropping, bricking, polishing, etc. MBD-CDW series have the uniform blocky particle shape and the clean surface, provide the excellent cutting performance for diamond wire, excellent diamond retention and no wire breakage, enhanced flatness of cut materials, reduced process lead time and kerf loss.