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Jiangsu Tianheng Nanometer Technology Co.,Ltd
[ Jiangsu, China (Mainland) ]

    Main Products:
  • cmp slurry
  • polishing slurry
  • silica sol
  • active agent
  • clean liquid
    Business Type:
  • Manufacturer
  • Trading Company

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iAbrasive AD

Sapphire Substrate CMP Slurry

Product Details

Jiangsu, China (Mainland)

THNM

UPP/SAS01

Burnishing Compound

Ivory

Payment & Shipping Terms

Ton

2

USD 5000.000 - 7000.000

Shanghai

25kg/barrel or IBC barrel

Yes

5000 / Year

T/T, Western Union

Detailed Product Description

CAS No. 14808-60-7;
Other Names polishing slurry
MF SiO2
EINECS No. 215-683-2;
Place of Origin Jiangsu, China (Mainland)
Grade Standard Industrial Grade, Electron Grade
Purity 35%
Appearance ivory
Application high quality polishing of sapphire
Brand Name THNM
Model Number UPP/SAS01
Color ivory
PH 11.0~12.0
polishing Slurry
1.High concentration
2.Small abrasive size
3.Small surface strain
4.Easily washed,High polishing speed
产品详细描述

polishing slurry

 

Introduction

 

UPP/SAS01 Sapphire Substrate CMP Slurry is a new generation water-solubility high-purity colloid polishing slurry invented by Jiangsu Tianheng Nanometer Technology Co., Ltd.The product is mainly used in high quality polishing of sapphire.High polshing rate,high surface flatness and low roughness reach advanced international level.Apply to warious treating way,having characteristics of long using life-span,high smoothness,strong suspension and easy to wash off.Its preminent function has also got full acknowledgment in applying to reality,and mainly used in the polishing of sapphire,with high precision requirement.

 

Main Characteristic

 

UPP/SAS01 Sapphire Substrate CMP slurry is nanometer SIO2 hydrosol,with characteristic of little pollution,easily washed,high polishing rate,small damage layer,processing components to avoid scratching the phenomenon,and high flatness.The ratio can be optimized according to requirement.Compared with the same style product of oversea,the virtues of the product are high concentration,small abrasive size,small surface strain,easily washed for organic,metal ion and particle,high polishing speed,no uniform etch pit.

 

Application

 

The product is mainly used in high quality polishing of sapphire.

 

Fundmental parameter

 

PH Specific gravity Viscosity( 25 °C,mPa.s ) Abrasive particle size Sodium oxide Concentration(%) Abrasive concentration Aspect
11.0~12.0 >1.10  <10.0  30~50(nm)  <0.3  >35%  Ivory

 

Employ Method 

 

The ratio of original polishing slurry to DI water is 1:5,or adjust according to process.

During the polishing  process,the recommended amount of added alkaline polishing agent,polishing will help get better results.

 

Transportation

 

1.Temperature at 5 °C ~50 °C .Avoid light in order to avoid the slurry metamorphism.

2.Period of validity:1 year,propose to use out within half year.

3.Avoid introduce with strong electrolyte;Avoid pollution of metal and patricle.

Package:25kg/barrel.

 

 

 

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